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Tungsten copper heat sink

W60Cu40 heat sink

W60Cu40 heat sink
  • Composition: W 60%, Cu 40%
  • Density: 13.1g/cm3
  • Coefficient of Thermal Expansion (10-6/K): 10.5
  • Length: 5mm-100mm
  • Width: 5mm-100mm
  • Thickness: 0.2mm-5.0mm

Tungsten Copper high performance composites are fabricated from carefully controlled porous tungsten that is vacuum infiltrated with molten copper. This results in a WCu composite that has high conductivity and a matched low thermal expansion for heat sinks.

Tungsten copper heat sink is a composite of tungsten and copper. The coefficient of thermal expansion (CTE) of the composite can be designed by controlling the content of tungsten, matching that of the materials, such as Ceramics (Al2O3, BeO), Semiconductors (Si), Metals (Kovar), etc. The products are widely application in the fields such as radio frequency, microwave, high power diode packaging and optical communication system.

Advantages: High thermal conductivity, Excellent hermetic, Excellent size control, surface finish and flatness, Semi-finished or finished (Ni/Au plated) products available properties of WCu and MoCu heat materials

The data of copper tungsten heat sink

Ingredient Name

CAS Number

% Weight

Tungsten 7440-33-7 50-90
Copper 7440-50-8 10-50

 

Composition
(Wt%)

W 90%
Cu 10%

W 88%
Cu 12%

W 85%
Cu 15%

W 80%
Cu 20%

Density
(g/cm3)
17.0 16.6 16.4 15.5
Coefficient of Thermal
Expansion(10-6/K)
5.6 5.7 5.8 7.0
Thermal Conductivity
(W/mK)
180 188 196 220
Specific Heat Capacity
(J/kgK)
155 165 175 190
Young’s Modulus
(Gpa)
325 315 305 278
Specific Electrical
Resistance(uΩm)
0.047 0.045 0.042 0.035
Vickers Hardness
(HV10)
300 295 275 255
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