W60Cu40 heat sink
- Composition: W 60%, Cu 40%
- Density: 13.1g/cm3
- Coefficient of Thermal Expansion (10-6/K): 10.5
- Length: 5mm-100mm
- Width: 5mm-100mm
- Thickness: 0.2mm-5.0mm
Tungsten Copper high performance composites are fabricated from carefully controlled porous tungsten that is vacuum infiltrated with molten copper. This results in a WCu composite that has high conductivity and a matched low thermal expansion for heat sinks.
Tungsten copper heat sink is a composite of tungsten and copper. The coefficient of thermal expansion (CTE) of the composite can be designed by controlling the content of tungsten, matching that of the materials, such as Ceramics (Al2O3, BeO), Semiconductors (Si), Metals (Kovar), etc. The products are widely application in the fields such as radio frequency, microwave, high power diode packaging and optical communication system.
Advantages: High thermal conductivity, Excellent hermetic, Excellent size control, surface finish and flatness, Semi-finished or finished (Ni/Au plated) products available properties of WCu and MoCu heat materials
The data of copper tungsten heat sink
|
Ingredient Name |
CAS Number |
% Weight |
| Tungsten | 7440-33-7 | 50-90 |
| Copper | 7440-50-8 | 10-50 |
|
Composition |
W 90% |
W 88% |
W 85% |
W 80% |
| Density (g/cm3) |
17.0 | 16.6 | 16.4 | 15.5 |
| Coefficient of Thermal Expansion(10-6/K) |
5.6 | 5.7 | 5.8 | 7.0 |
| Thermal Conductivity (W/mK) |
180 | 188 | 196 | 220 |
| Specific Heat Capacity (J/kgK) |
155 | 165 | 175 | 190 |
| Young’s Modulus (Gpa) |
325 | 315 | 305 | 278 |
| Specific Electrical Resistance(uΩm) |
0.047 | 0.045 | 0.042 | 0.035 |
| Vickers Hardness (HV10) |
300 | 295 | 275 | 255 |
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