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Cu-Mo70Cu-Cu heat sink

Cu-Mo70Cu-Cu heat sink

Cu/Mo70Cu/Cu (CPC) is a sandwich composite like Cu/Mo/Cu including a Mo70-Cu alloy core layer and two copper clad layers. The ratio of the thickness in Cu:Mo-Cu:Cu is 1:4:1. It has different CTE in X and Y direction, higher thermal conductivity than that of W(Mo)-Cu, Cu/Mo/Cu and more cheap. All types of Cu/Mo70Cu/Cu sheets can be stamped into components.

The features of Cu/Mo70Cu/Cu

  • Large sized sheets available (length up to 400mm, width up to 200mm)
  • More easily to be stamped into components than CMC
  • Very strong interface bonding which can repeatedly resist 850°C heat shock
  • Higher thermal conductivity and lower cost
  • No magnetism

The information of Cu/Mo70Cu/Cu

Cu/Mo70Cu/Cu

Density
g/cm3

CTE
ppm/K

TC,
W/m·K

X direction Y direction In-plane Thru-thickness
1:4:1 9.46 7.2 9.0 340 300
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